products

High-Layer-Count PCB

■ Product Strengths
Dynamic started mass production of HLC products used in network communication base stations, GPRS core networks, server related products, etc. since 2010 and support our customer to grow fast in cloud computing market.

■ Technology Capability

  • Reliability test system that meets the requirements of the major global server providers;
  • Meet major global server equipment providers’ requirements for signal loss measurement and verification
  • Master the expansion and contraction control technology of various materials
  • Rich experience in using low-loss materials
  • Have a dedicated FAE team for technology and design that cooperates with customer in product development.

HDI PCB

■ Product Strengths
HDI is high density layout with small line width/space and distance between line to holes, it gives circuit design better flexibility. It is mainly used in advanced driver assistance systems (ADAS), wearable devices, 5G related communication boards, high-end laptops, SSD, medical products, etc.

■ Technology Capability

  • Layer to layer registration: +/-50um;
  • Copper fill Dimple:
  • Copper fill aspect ratio (A/R): 0.86:1;
  • Min. line width/space: 40um/50um
  • Conductive layers for mass production: 5+n+5;
  • Any-layer design for mass production: 14 layers.

*HDI PCB with 4+2+4 design *HDI PCB with Anylayer design

Semi-Flex PCB

■ Product Strengths
Semi-flex PCB is with a bending area on rigid board by blind routing technology.Semi-flex product has a better heat tolerance than rigid-flex, which is widely used in high reliability parts of automotive products.

■ Technology Capability

  • Remaining thickness on bending area: 0.25+/-0.05mm;
  • Maximum bending layers: 3 layers;
  • Inner layer copper thickness in bending area: 70um (2oz);
  • When bending angle is 90 degree, the minimum bending times is 10 times. If bending area width is ≥8mm, the bending times can be up to 50 times.
  • When bending angle is 180 degree, the minimum bending times is 5 times. If bending area width is ≥12mm, the bending times can be up to 15 times.

High Frequency PCB

■ Product Strengths
Design with micro strip antenna arrays or SIW on the PCB to achieve signal receiving and transmission. The product has small size with highly integrated features, performs well under various climates and environments. We have been dedicated to this technology for many years and offers multiple radar technology solutions. Mainly used in automotive radar (ACC, AEB, FCW), security radar, UAV measurement, distance radar, smart home radar, smart road network radar, antenna, macro base station, small base station, satellite receiver, etc.

■ Technology Capability

  • Patch antenna accuracy: ±10um
  • Via position accuracy for SIW: ±15um
  • Depth consistency of mechanically drilled blind via
  • Warpage: ±0.5% (Symmetrical), <1.0% (unsymmetrical)
  • Various combinations of HF materials and hybrids

Heavy Copper PCB(High Current)

■ Product Strengths
The copper weight in inner layer or outer layer exceed 105um (3oz) are considered thick copper PCB. Power modules, fuse box, junction box, quick charge, and high voltage/current modules use thick copper PCB.Heavy copper PCB are usually designed as thick copper in the inner or inner and outer layers, and there are multiple layers of prepreg between the copper layers. The substrate is also resistant to high voltage/high current.

■ Technology Capability
Heavy copper PCB needs to adjust a number of parameters during etching to achieve the desired pattern due to the thickness of copper. In addition, the filling during lamination between the lines is also a key technology.Dynamic master this aspect of production technology can provide customers with PCB products that meet high reliability requirements.Mass production process capability: 140um4oz 8layers, 210um6oz 4layers、210um(6oz) 4layers

12oz heavy copper PCB filling 12oz heavy copper PCB after etching

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Updated on Aug 25, 2022